Disco Dicing Saw Disco Dicing Saws are high-precision cutting tools used in the manufacture of microelectronic components, such as semiconductor wafers and printed circuit boards. They are …

Wire saw machines Yasunaga’s wire saws can make highly-accurate and thin slices from large volumes of brittle and hard materials. Our machines can be used in various fields, such as next generation …

Wafer sawing is one of the back-end technologies of advanced packaging. Higher quality and narrower saw street can improve the density of die in one wafer, thus reduce the wafer cost. In this …

Flagship model for Φ300 mm wafers with high process extensibility Φ300 mm Facing dual spindle DBG

1 Introduction The technology of silicon wafer dicing to separate each die from the wafer has been developed over the past five decades. Mechanical wafer dicing using a dicing saw was the industry …

Dec 12, 1996 · A wafer slicing saw is a machine used to slice silicon ingots into silicon wafers. It is key to an important step in the production of silicon wafers that go on to be used as raw material in the …

Wafer dicing equipment including manual to fully automatic dicing saws, wafer mount, and washing systems and water filtration units.