A new technical paper titled “DECOR: Deep Embedding Clustering with Orientation Robustness” was published by researchers at Oregon State University and Micron Technology. “In semiconductor ...
MILPITAS, Calif., July 10, 2018 /PRNewswire/ -- Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in tool and process monitoring ...
Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...
Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...
KLA leverages cutting-edge semiconductor inspection tech, partnering with industry leaders like TSMC and Samsung. This positions them to capitalize on the growing demand for 2nm and 3nm chip ...
Wafers can be inspected for large, obvious defects, or for small, subtle ones. The former is referred to as macro-inspection, while the latter is micro-inspection. These processes use different ...
As semiconductor manufacturers aim to produce devices at the 5-nanometer node, the ability to find tiny defects created inadvertently during the fabrication process becomes harder. In addition, there ...
MILPITAS, Calif., July 20, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the revolutionary eSL10™ e-beam patterned-wafer defect inspection system. The new system is designed to ...
SAN JOSE –KLA-Tencor Corp. today said it is the first company to supply a fully automated system for inspection of wafer backsides during the production of 0.13-micron ICs on 300-mm silicon substrates ...
With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, depending on complexity, a ...
ST. PETERS, Mo.–MEMC Electronic Materials Inc. here today announced an agreement with Ibis Technology Corp. to develop advanced silicon-on-insulator wafer substrates using separation-by-implantation ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback