In the past few years, there have been a number of announcements involving advanced packaging architectures for semiconductor devices. These architectures offer product designers tremendous ...

Unlike the traditional system on chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and outsourced ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

In order to assist manufacturers in complying with the ISO 11607 standard requirements for packaging process development, equipment manufacturers are increasingly incorporating validation software and ...

As Intel launches its new foundry business, its first customers include Qualcomm and Amazon Web Services, the chipmaker said Monday. Intel also shared the process and packaging technology roadmap that ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

When one thinks of leading-edge semiconductor companies, companies such as Intel, AMD, and Samsung instantly come to mind. But as more semiconductor companies emphasize IP and outsource their ...

Semiconductor manufacturing equipment maker KLA Corporation (NASDAQ:KLAC) beat Wall Street’s revenue expectations in Q3 CY2025, with sales up 13% year on year to $3.21 billion. Guidance for next ...

Compostable plastic packaging market projected to reach $203 billion by 2035 driven by EPR programs and sustainability ...