TL;DR: Intel's 18A process node, set for tape-out in 1H 2025, aims to compete with TSMC, marking a significant comeback for Intel in the semiconductor industry. Featuring BSPDN, RibbonFET GAA ...
Since 2021, Intel has pledged over $100 billion towards global manufacturing expansion, anchored by significant new fabs in ...
Lip-Bu Tan, the chief executive of Intel, is considering stopping the promotion of the company's 18A fabrication technology (1.8nm-class) to foundry customers, instead shifting the company's efforts ...
Intel Corporation's Q3 '24 results showed impairments and write-offs, but the core business performance was better than expected, though not an inflection point in its turnaround. Intel's aggressive ...
29 April 2025, USA, San Jose: Lip-Bu Tan, Chief Executive Officer of Intel, appears at an event organized by the company. Photo: Andrej Sokolow/dpa (Photo by Andrej Sokolow/picture alliance via Getty ...
Why it matters: As Intel's chip design and foundry businesses face mounting pressure that could jeopardize the company's future, much is riding on the success of its upcoming 18A node. As Intel ...
TL;DR: Intel unveiled its advanced 14A process node featuring second-generation PowerVia PowerDirect technology and RibbonFET 2, enabling superior power efficiency and performance. Utilizing ASML's ...
TSMC is on track to start high-volume production of chips on N2 (2nm-class), its first production technology that relies on gate-all-around (GAA) nanosheet transistors, in the second half of this year ...
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