According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

You’re probably familiar with the little black boxes nestled neatly inside your favorite devices. With their diminutive size and unassuming characteristics, it can be hard to believe these vessels are ...

MILPITAS, Calif., Sept. 21, 2020 /PRNewswire/ -- Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the Kronos™ 1190 wafer-level packaging inspection system, the ICOS™ F160XP die sorting ...

For high-bandwidth applications in large data centers, 5G communication, and space-graded applications like satellites, there is a huge demand for miniaturizing power supplies. With the limited ...