Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...

Intel is providing a sneak peek (in rendered form) of its upcoming Lakefield processor family, which is based off its new Foveros three-dimensional stacked packaging technology that it detailed during ...

Intel has unveiled a new packaging innovation for creating 3D chip packages and multiple chip connections ahead of the Semicon West conference in San Francisco this week. The company is detailing its ...

The organizers of Hot Chips 33 have confirmed an exciting schedule, where we will receive some juicy details on "Advanced Packaging" technology. Intel and TSMC will be discussing their "packaging ...

Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun with Intel's ...

AMD is raising the bar in its battle against Intel in the data center with a new lineup of EPYC CPUs that use its 3D packaging technology to triple the L3 cache, giving them a significant hike in ...

Texas Instruments has announced its latest mobile processor, the TI OMAP4440, a SoC packaging a pair of 1.5GHz ARM Cortex-A9 MPCore CPUs along with two ARM Cortex-M3 cores to power-efficiently offload ...