Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

In this interview, Mark Bumiller, Technology Manager for Entegris talks to AZoM about using the Accusizer to detect large particles counts in CMP slurries. Please could you give us an introduction to ...

(MENAFN- PR Newswire) "Wafer mass metrology has become increasingly important as semiconductor processes have become more complex and sensitive," said Microtronic CEO Reiner Fenske in making the ...

Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2003--Applied Materials, Inc. (Nasdaq:AMAT) announces Reflexion(R) LK, the industry's only low down force, high throughput CMP (chemical mechanical ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

Applied Materials Inc. will integrate single-wafer vapor drying technology from SCP Global Technologies into its Applied Reflexion LK CMP system, the company announced today. Applied has obtained a ...

CHANDLER, Ariz., Sept. 24, 2024 (GLOBE NEWSWIRE) -- Axus Technology, a leading global provider of chemical mechanical planarization (CMP) equipment, critical for semiconductor and compound ...

BOCA RATON, Fla.--(BUSINESS WIRE)--June 28, 2005--Quartz Unlimited LLC. is offering a cost saving alternative of using reclaimed TEOS or thermal oxide dummy wafers for CMP(a) tools retaining ring ...