SAN FRANCISCO, June 27, 2024 /PRNewswire/ -- Dr. Larry Zu, Founder and CEO of Sarcina Technology, the Application Specific Advanced Packaging (ASAP) Design Service and Production leader, predicted ...
As semiconductor devices scale for AI computing, advanced packaging and high density interconnects, manufacturers face growing challenges in measuring ultra ...
There's better, cost-effective path to 2.5D packaging landscape SAN FRANCISCO, June 27, 2024 /PRNewswire/ -- Dr. Larry Zu, Founder and CEO of Sarcina Technology, the Application Specific Advanced ...
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